Four days back, we come up with leaked LG G6 Prototype pictures. Now some new pictures have been leaked. One shows that the phone will consists of a glossy back cover. Another leak shows that the phone will consists of a brushed metal rear. In LG G6 smartphone, manufactures are using Snapdragon 821 chipset instead of using latest Snapdragon 835 chipset. However, Samsung is offering latest Snapdragon chipset in Galaxy S8.
We are not against Snapdragon 821, it’s just like why LG is not using the latest chipset available. LG G6 will come up with Ringke bumper which provides the device a great look. One more thing, there are no buttons in the front of the device. The device consists of dual cameras on the back consisting of two snappers flanking with flash module. Below these dual cameras, there is a finger print scanner.
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The volume button is on the same side with the power button. And SIM’s slot is on the right side. Earphone jack and antenna lines are on the top of the headset. In bottom of the phone, there is Type – C USB port with a cover in order to protect the opening. However users would be getting only two color options – black and silver. We expect to see the LG G6 unveiled at MWC on February 26th.